This solution replaces the subtractive process chain with the layered process steps in electronic production, which has always been one of our transformation concepts. It reduces material waste and improves production efficiency. Most importantly, this solution improves process stability and has become a new feature in today's electronic component production process. This breaks through the limits of current production technologies for rigid and flexible circuits using any substrate material. Whether it is single chip PCB panels or FPC roll to roll double-sided technology, they will be the preferred platform for the production of stacked electronics。
Using our solder mask printing solution to print solder mask layers, developed specifically for industrial production, it is powerful and performs the best. It is also possible to choose a system that integrates automatic loading and unloading of substrates for printing FPC electronic products. Functional materials are applied with high precision to print antennas, sensors, or touch displays on PET films. Other application areas are medical technology or battery or fuel cell production。
优势Based on the solution, we also provide a system that can handle UV curing and etching resistance. This system can be used for the application of different corrosion inhibitors in PCB production or micro etching. Anti etching process is a three-step digital printing process that can increase production and quality while reducing manufacturing costs. The steps are: pre-treatment, direct inkjet printing with resistance to etching, in-situ UV drying, and etching/cleaning。
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